SE500-X™
Fastest, Most Accurate 3-D SPI (Large Board)


SE500-X

With SE500-X™ - 100% 3D solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X™ is capable of inspecting the most demanding assemblies with 80cm²/sec inspection speed without compromising on measurement accuracy and repeatability.

Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500-X™ can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

SE500-X™ is designed to help you achieve high quality solder joints in your SMT process through accurate volume measurement of each solder paste deposit every single time.

Key Features & Benefits

  • Large Board Handling – Supports large boards up to 810 x 612 mm
  • Fastest 3-D SPI – 80cm2/second inspection speed that doesn’t compromise measurement accuracy and repeatability.
  • Most accurate SPI – Inspects pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing lines speeds.
  • Superior 3D Measurement Capability – Provides 3D height, volume and area measurements for PCBs with CSPs, micro-BGAs, 0201s, 01005s and other small pad sizes.
  • Efficient warpage handling – Equipped with flexible circuit warp compensation algorithm to compensate for warp on complex shapes
  • Closed Loop Feedback Ready – Supports closed loop feedback with major printers to optimize the solder printing process
Specifications
Board Size (Max.) 810 x 612 mm
Board Size (Min.) 100 x 100 mm
Inspection Speed @ 30µm 80cm²/sec
Inspection Speed @ 15µm 50cm²/sec
Gage R&R <<10%, 6σ