SE3000™ 3D SPI
A Leap Forward in Solder Paste Inspection


SE3000 3d spi

Maximize yields with the World’s First SPI system incorporating the MRS Sensor technology. When only the very best will do.

The new SE3000 3D SPI system is the world’s first SPI system to incorporate the industry-leading Multiple-Reflection Suppression (MRS) technology with a finer resolution for the best accuracy, repeatability and reproducibility – Even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, solder paste inspection has reached a new level of precision for the most stringent requirements.

SE3000-DD Dual Lane, Dual Sensor system and SE3000-X also available.

Specifications
Board Size (Max.) 510 x 510 mm (20.0×20.0 in.)
Board Size (Min.) 50 x 50 mm (2.0×2.0 in.)
Inspection Speed @ 18µm 50cm²/sec ave.
Inspection Speed @ 9µm 20cm²/sec ave.
Gage R&R* <<5%, 6σ on Printed Circuit Board; <<2%, 6σ on Certification Target
*Under controlled conditions