Did you know China will be the #1 spending region for fab equipment?
With 20, and possibly more, new fab projects underway or announced in China since 2016, spending on fab equipment will surge to $10 billion or more, annually, by 2018 and to even higher levels in the following two years. As a result, China is projected to be the top spending region for fab equipment in 2019 and 2020, according to SEMI.org.
We hope to see you at SEMICON China.
Highly Efficient and Effective Wireless Airborne Particle Sensors to be Showcased at SEMICON China
APS2 technology incorporates a wider range of particle sizes in sensors that speed processes and improve yields
CyberOptics will demonstrate its latest Airborne Particle Sensor technology (APS2) with an extended particle size range at SEMICON China, March 14-16th at the Shanghai New International Expo Center in booth #5775, 1459 and 5330.
CyberOptics’ WaferSense® and ReticleSense® APS2 portfolio speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. CyberOptics APS2 sensors have proven to deliver up to 88% timesavings, 95% expense reduction and up to 20X the throughput with half the manpower relative to legacy surface scan wafer methods.
The APS2 portfolio now measures a greater range of particle sizes, with the industry-leading accuracy and sensitivity valued by semiconductor fabs and equipment OEMs.
“Equipment engineers at fabs around the world rely on our wireless Airborne Particle Sensors as the documented Best Known Method (BKM).” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Our APS2 devices save them significant time, expense and improve their yields.”
At SEMICON China, CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.
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