CyberOptics Launches Next-Generation Airborne Particle Sensor Technology
CyberOptics Features All-in-one Sensor That Saves Time and Expenses While Improving Yields
CyberOptics recently debuted its next generation Airborne Particle Sensor (APS) technology, APS2, in both WaferSense® and ReticleSense® form factors at SEMICON Europa 2015. This technology is even more sensitive, accurate and versatile.
CyberOptics’ Airborne Particle Sensors improve equipment set-up and long-term yields in semiconductor fabs by wireless monitoring airborne particles in real-time. This next-generation APS2 enables:
- Better Accuracy: An 80% improvement with 5 vs. 25 false counts/hour
- Increased Sensitivity: Measurement of even smaller particles down to .14 microns
- Greater Versatility: Thinner and lighter form factor travels through virtually all tools
“The technology enables even greater precision,” said Dr. Subodh Kulkarni, president and chief executive officer, CyberOptics. “We’re delivering even more value to the semiconductor fabs and OEMs by advancing a technology that they have relied upon to save time, save expense and improve yields.”
The new APS2 quickly monitors, identifies and enables troubleshooting of airborne particles down to .14um within semiconductor process equipment and automated material handling systems. CyberOptics’ APS2 technology easily identifies when and where the particles originate and speeds equipment qualification with wireless measurements, shortens equipment maintenance cycles with wafer-like and reticle form factors and lowers equipment expenses by providing objective and reproducible data.
At the SEMICON Europa show, CyberOptics demonstrated its new WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration and humidity in an all-in-one wireless real-time device. With its thin and light form factor, the AMS travels through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.