Addressing Various Challenging Inspection & Measurement Applications for Socket Metrology, Packaging, Microelectronics and More

CyberOptics Video

Interview with Dick Johnson, Director of Engineering, CyberOptics at APEX 2018

Q: What’s new in terms of expanding the applications that your MRS sensor technology can address?

A: We started around three years ago with our SQ3000™ 3D AOI (Automated Optical Inspection), which was our launch vehicle, our first 3D technology that used our MRS (Multi-Reflection Suppression) technology. We then built on that and added a level of measurement capability. Our customers were interested in AOI component placement, they were interested in measurement data so we built on that measurement capability and we evolved it to include CMM coordinate measurement performance so now we have our SQ3000 doing AOI and coordinate measurement machine (CMM) capable applications like measurements on CPU sockets and other machined parts or molded parts for example. Now we have customers using it for SPI (Solder Paste Inspection), so we have the ability to do SPI and AOI and CMM applications in the single SQ3000 platform.

Q: CyberOptics has also launched a new high-end 3D SPI system?

A: Yes, here at the show, we have launched our SE3000™, which is an SPI specific version of this platform for high speed, high precision SPI that uses the MRS sensor technology inside. It is unique in the industry and what we have seen from the data we’ve gathered, is that the MRS technology that is in our SE3000 system gives us an extra level of speed and performance we can match our SE600™ SPI speed advantage that is better than competition with our higher resolution MRS technology for greater precision and greater accuracy so we can do high speed and high precision – something no one else is doing in the industry.

Q: Who are your target customers for the SE3000?

A: The main target customers or the people we see that are interested in this are the people doing microelectronics, doing sub-100 micron solder paste deposits, people doing very small LEDs, micro LEDs, mini LEDs as well as people doing paste printing onto chip products – the packaging markets and high-precision assembly markets.
From my point of view, our technology gives us a really strong position. We are unique, our technology gives us unique capabilities, and we have really seen it take off in the last few years. We’ve found customers with challenges that nobody else has been able to solve, not even close, so we are on a march to continue to leverage the MRS technology, the SQ3000 platform and now with its’s sister the SE3000 3D SPI and find new applications and solve these difficult problems for our customers.

Q: What are some of the challenging applications you are referring to?

A: The power and the flexibility of our MRS technology and the SQ3000 platform that it’s integrated into, has enabled us to find applications and needs in the markets like the packaging market where we are able to do high-speed, high-density inspection. We are able to do shiny flip chip inspection.

We are looking at and working on automotive where they typically have large components we are doing LED headlights inspections where we are looking at large ribbon loop hydrant inspection. We are looking at the weld and the adhesive inspection in those automotive industries and we are looking at relay boards and large power assembly inspection where those customers have valued our unique 24-millimeter inspection height.

We are seeing applications in the medical industry and one of the areas in particular is our ability to do side inspection, as well as seeing and measuring the tops of components, making sure they are in the right place and they are the right type. We can also look at the side to look for side damage and side downside dimensions and side defects on those applications.

MRS is a very flexible, very wide-ranging 3D sensing technology. It has also been used for flux inspection. We are using it for wire bond inspection. We are looking at applying it to dye-attached applications and other. It has really opened up more opportunities and more customers and we are able to solve more problems.

Q: Do you see opportunities to further penetrate applications you are now addressing, as well as new applications with the MRS technology?

A: I feel very confident. I think we as a company are very confident and we are seeing that confidence translated into growing sales and growing success in applications where we are able to provide a unique solution given our unique technology.

CyberOptics Corporation
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