Updates


We’re on a world tour with the NEW ReticleSense™ Airborne Particle Sensor (APSR)

Subodh Kulkarni | CyberOptics CEO | Semicon West

On the heels of shows in China, Korea and Germany, we demonstrated the new APSR at Semicon West in San Francisco. Next up – Semicon Europa and Semicon Taiwan.

Subodh Kulkarni | CyberOptics CEO | Semicon West

Photo of Subodh Kulkarni, CyberOptics CEO at Semicon West

Did you know?

The new APSR enables equipment engineers to shorten equipment qualification, release to production and maintenance cycles all while reducing expenses. The APSR incorporates the same valued technology as the WaferSense APS in use today by major OEMs and semiconductor fabs.

Customers have experienced up to 88% time savings, up to 95% reduction in costs and up to 20X the throughput with half the manpower requirements using the WaferSense® Airborne Particle Sensor (APS) relative to legacy surface scan wafers.

Unlike traditional methods, the wireless, real-time capability of ReticleSense APSR allows users to quickly identify when and where particles and measure the effectiveness of cleaning adjustments and repairs in real-time.

Equipment and process engineers from semiconductor fabs around the globe turn to CyberOptics for their wireless measurement solutions that save time and money – improving yields and tool uptime.

Knowing they are using the most efficient and effective wireless measurement devices for their needs whether it’s for chamber gapping, leveling, wafer handoff teaching, vibration or airborne particle measurement, equipment and process engineers have peace of mind they are using the most accurate and precise devices in the market – Making life, easier.

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Press Releases

04. 09. 18

CyberOptics, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will hold its conference call to review operating results for the first quarter of 2018 on April 24 at 9:00 AM Eastern. The first quarter earnings release will be issued prior to the call.

03.29.18

CyberOptics announces it will demonstrate the SQ3000™3D Coordinate Measurement Machine (CMM) along with the new MRS-enabled SE3000™ Solder Paste Inspection (SPI) system in Stand 1F32 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.

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