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CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology Recognized as Best Known Method (BKM) at SEMICON China

CyberOptics Display w SW

CyberOptics® will demonstrate its next generation Airborne Particle Sensor technology (APS3) 300mm with new ParticleSpectrum™ software at SEMICON China, March 14-16th at the Shanghai New International Expo Center in booth #5182 and #1202.

SC_China_logoCyberOptics’ WaferSense® APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles. Now in a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers. In addition to small particles, the large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.

CyberOptics APS3

Airborne Particle Sensor technology (APS3)

“We have advanced what Semiconductor fabs have recognized as the Best Known Method (BKM) for particle sensing,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Delivering significant improvements in yields and tool up-time.”

The APS3 solution incorporates ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data and see the effects of cleanings, adjustments and repairs in real-time.

CyberOptics Display w SW

ParticleSpectrum software

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05. 28. 18

CyberOptics announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The company will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum™ software in Booth #6163.

05. 09. 18

CyberOptics will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.

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