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CyberOptics to Demonstrate Award Winning Technology at SMT/Hybrid/Packaging

smt hybrid packaging

CyberOptics announces that it will exhibit in Booth #7-109 (smartTec GmbH) at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. CyberOptics will demonstrate the SE600™ and the award winning SQ3000™ 3DAOI.

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The Ultimate in Speed and Accuracy

CyberOptics recently won the 2015 Global Technology Award in the category of Inspection – AOI for its 3D SQ3000 Automated Optical Inspection (AOI) system. The system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate sensor platforms.

The proprietary Multi-Reflection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

“Customers have been rapidly adopting our 3D AOI systems. The positive feedback we have received about the superior image quality and the overall performance that the MRS technology enables, is very encouraging,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics.

smt hybrid packagingCyberOptics will also demonstrate the SE600™ 3D SPI system that delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits.

The award-winning software offers full touch screen capability and world-class user experience for easy, flawless inspection.

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Press Releases

05. 09. 18

CyberOptics will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.

05. 08. 18

CyberOptics will demonstrate the MRS-Enabled SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications at SMT Nuremberg, Germany, June 5-7 at the Messe GmbH in hall 4, stand 101.

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