CyberOptics Promotes Award-Winning 3D AOI Inspection at NEPCON Malaysia


At the recent NEPCON Malaysia tradeshow, which took place June 9-11, CyberOptics exhibited with its representative Dual Matrix to showcase CyberOptics’ newly launched 3D AOI system alongside 3D SPI and 2D AOI systems.

sq3000The SQ3000™ 3D Automated Optical Inspection (AOI) system maximizes ROI
and line utilization with multi‐view 3D sensors that capture and transmit data
simultaneously, and in parallel, enabling the fastest 3D inspection in the
industry. The MRS technology inside combined with the highly sophisticated 3D
fusing algorithms offers microscopic image quality at production speeds. An
easy‐to‐use, intuitive interface with touch control facilitates minimal training
and operator interaction.

The SE600™ 3D SPI system delivers ‘true’ volume measurement and world‐
class usability. Designed with a state‐of‐the‐art dual illumination sensor, it
offers the best repeatability and reproducibility – even on the smallest paste
deposits. The award‐winning SPIv5 series software offers full touch screen
capability and world‐class user experience for easy, flawless inspection.

qx150iThe QX150i™ AOI system offers high value, flexible inspection for all
applications and is ideally suited for pre‐reflow and selective solder inspection.
With higher sensor resolution (12µm) and enhanced illumination, QX150i™
offers crisp images for accurate inspection with lowest false call rates. Also, the
system is designed to provide easy wedge‐in replacement of existing

All CyberOptics’ AOI systems are powered by AI2 (Autonomous Image Interpretation), giving you the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All of this means the lowest false calls, zero escapes and minimal tuning.

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04. 09. 18

CyberOptics, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will hold its conference call to review operating results for the first quarter of 2018 on April 24 at 9:00 AM Eastern. The first quarter earnings release will be issued prior to the call.


CyberOptics announces it will demonstrate the SQ3000™3D Coordinate Measurement Machine (CMM) along with the new MRS-enabled SE3000™ Solder Paste Inspection (SPI) system in Stand 1F32 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.

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