CyberOptics Introduces New WaferSense® and ReticleSense® Auto Multi Sensors (AMS)


Leveling, Vibration and Humidity Measurement All-in-one Sensor Saves Time and Expenses While Improving Yields

Minneapolis, MN—July 8, 2015— CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces the first wireless sensor to combine leveling, vibration and humidity measurement in an all-in-one multi sensor, available in both WaferSense® or ReticleSense® form factors.7_10_15_AMS

Semiconductor fabs and OEMs worldwide have adopted the wireless WaferSense and ReticleSense measurement devices to enable improvements in fab yields and equipment uptime. The new Auto Multi Sensor (AMS) line, a new addition to the portfolio, will be on display at SEMICON West 2015, the premier annual event for the global semiconductor industry, in San Francisco July 14-16, 2015, booth #2511.7_10_15_AMS-icons

“Our customers value the leveling and vibration devices for precise and accurate measurements in the fab environment,” said Subodh Kulkarni, President and CEO of CyberOptics. “We have also learned that equipment and process engineers often use these two devices in conjunction with each other. In order to make this even more convenient, we have developed an all-in-one solution that is thinner and lighter weight for ease of travel through any tool.”

CyberOptics has also added a Relative Humidity (RH) measurement capability to the AMS devices. RH is becoming increasingly more important in many processes such as controlling the amount of oxidization on the wafer or electro-static discharge (ESD) issues in the fab. This versatile solution is a combination sensor capable of multiple measurements now available in one convenient device.

About the WaferSense and ReticleSense Line

The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm, 300mm and 450mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ), the Auto Leveling System (ALSR) and the new Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.

For more information about the entire line of CyberOptics solutions please visit the company’s website at

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CyberOptics will demonstrate the WaferSense® and ReticleSense® APS2 technology at Semicon Japan at Tokyo Big Sight, December 16th – 18th in booth #4804.

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CyberOptics announced that it received a follow-on order valued at approximately $750,000 for SQ3000 automated optical inspection systems, based upon the company’s 3D Multi-Reflection Suppression (MRS) inspection technology platform. This 3D AOI order is scheduled to ship in this year’s fourth quarter.

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