CyberOptics Advances 3D Sensor Technology with Leading Edge Capabilities

proprietary 3D sensing technology

Company develops unmatched 3D sensing capabilities by incorporating Multi-Reflection Suppression (MRS) technology, coupled with highly sophisticated 3D algorithms

proprietary 3D sensing technology

The image featured was captured using this ground-breaking, proprietary 3D sensing technology.

Leveraging a 30 year history of pioneering optical technology advancements including digital 3D inspection, CyberOptics now makes a significant step-change in 3D sensing. Delivering advantages that have previously been unachieved in the industry, this technology enables ultra- high quality 3D images at production speeds, using architecturally superior multi-view sensors and Multi-Reflection Suppression technology (MRS).

The multi-view 3D data is merged together with highly sophisticated algorithms and MRS which suppresses any reflection that can distort the data, enabling a precise 3D representation. This is particularly critical for inspecting shiny objects. The architecturally superior sensor design captures and transmits the data simultaneously and in parallel, vs. a typical serial approach used in alternate technologies. These breakthrough technology building blocks result in unmatched speed and accuracy.

“The combination of high quality 3D accuracy at low speed, or lower accuracy at high speed have both been accomplished, but achieving ultra-high quality 3D data at production speeds is only now achievable with the architecturally superior multi-view sensor incorporating Multi-Reflection Suppression technology,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “We continue to drive innovation that delivers even more value to our customers world-wide in terms of process, quality and operational efficiency improvement in manufacturing environments.”

With electronics packaging continuing to get smaller and the density increasing, defects become more of an issue, fuelling the need for precision inspection. This breakthrough sensor technology is not only applicable for 3D inspection in electronics assembly, but also the semiconductor market, both of which CyberOptics has a global market leading position in. Additionally, it also extends the company’s reach into the general purpose metrology industry, the third key market where CyberOptics is strategically focused.


Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we record in 2014; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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05. 28. 18

CyberOptics announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The company will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum™ software in Booth #6163.

05. 09. 18

CyberOptics will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.

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